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Rosmi Abraham

PhD Student

University of Alberta

Rosmi Abraham is a PhD student in the Dept. of Chemical and Materials Engineering at University of Alberta. Her work focuses on understanding the dynamics of microfluidic sensors for thermomechanical sensing of polymers and fluids. She has worked in Lorentz deformable mirror part of the LVDM project by NRC and would be giving a talk about different methods of through silicon via filling.

Rosmi Abraham's site

Sessions Rosmi Abraham is a part of

Thursday, June 9, 2022

What does the future of advanced manufacturing look like?

2:00 pm to 3:30 pm

in Salon 11

Talk Description

Investigation of methods of through silicon via filling using conductive paste and silver nanowires

Through silicon via (TSV) is a critical technology for 3D integration in various microelectromechanical sensors (MEMS) and actuators, allowing vertical electrical connection in a silicon wafer. The benefits of TSV are quite notable, as it helps with a reduction in chip sizes, lower power requirements, and enhanced bandwidth. The current filling method of TSVs based on electrodeposition or chemical vapor deposition has several limitations, including being expensive, requiring highly sophisticated equipment, time consuming, and still being susceptible to filling defects. In our work, a highly efficient and low-cost, one-step filling process is developed using an electrically conductive silver paste of different conductivity and viscosity. Preparation of the wafers, paste and application procedures would be discussed and the resultant SEM images, resistivity measurements would be presented.

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